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0.5mm ZIF SMT H1.2mm bottom contacts FPC/FFC connector :ERYAY42X-1.2

Brand ERYCO

Product origin CHINA

0.5mm ZIF SMT H1.2mm bottom contacts 4-60P FPC/FFC connector

Order Information

ERYAY42X-1.2-XX-T-L-R

XX-No.of 04 ~ 60pin

Height: 1.2mm

T-SMT Pin

L-Lower Contact

Packing: R-Reel   T-Tubes

Product parameter:

Material:

Housing: LCP UL94V-0

Contact:  Copper alloy

Plating: Tin Plated Over Nickel

Electrical Characteristics:

Voltage rating: 50 VAC

Current rating: 0.3 AMP

Dielectric Withstandingf Voltage: 500 VAC R.M.S.

Insulation resistance: 500m ohm Min

Contact resistance: 30m ohm. max.

Temperature range: -40 To +85

 

Applications

1. Telecommunications

2. LED Lighting

3. Testing and Measurement Equipmentity

4. Military and Aerospace

 

Features

-Pitch and Size: The connectors have a pitch (distance between adjacent contacts) of 0.5mm, suitable for applications requiring fine pitch connections. The overall height (H) is approximately 1.2mm, providing sufficient clearance for the flexible circuits and ensuring compatibility with standard PCB layouts.

-ZIF Mechanism: These connectors feature a Zero Insertion Force (ZIF) mechanism, which allows for insertion and removal of the flexible circuits without applying significant force. This minimizes the risk of damaging the circuits during assembly or maintenance, making them ideal for applications where frequent connection/disconnection is necessary.

-Bottom/Upper Contact Design: These connectors can have both bottom and upper contacts, where the contact points are located on both the underside and top side of the connector. This dual contact design facilitates versatile connectivity options, enabling direct contact with the PCB pads on either side for optimized electrical performance and reliable signal transmission.

-Surface Mount Technology (SMT): Designed for surface mount assembly, these connectors are soldered directly onto the surface of a PCB. This allows for efficient and automated assembly processes, ensuring secure mechanical attachment to the board and minimizing assembly time and costs.

 

Dimensions(Please refer to the attached 2D drawings for detailed specifications.):